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Your expert in Robotic Hot Solder Dip (HSD), Column Attach,
Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach,
BGA Reballing, and Trim & Form. Also Failure Analysis, Bond Pull,
Mark Permanency, Ball Shear, XRF, Solderability, and Fine & Gross Leak
Testing.
For over 34 Years, SIX SIGMA has
been advancing lead finish and soldering technology for the military,
aerospace, and commercial micro-electronics component industry.
SIX SIGMA is the technical leader and subcontractor of choice for the
alteration and testing of micro-electronic components to increase reliability,
mitigate tin whiskers, or achieve RoHS compliance.
Our team of experienced semiconductor assembly engineers
is committed to obtaining component lead finish excellence through the
development of innovative manufacturing processes and solutions.
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Careers
Join our great team.
Check out job openings here!
News
May 2023
DoD Announces $10 Million Defense Production Act Title III Agreement With Six Sigma
Oct 2015
Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages
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