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Acoustic Microscopy is used to detect delamination
in non-hermetic components. It is a method of determining hidden internal defects
such as voids, delaminations, cracks or disbonds that are invisible to the naked
eye. It is a non-destructive internal inspection that makes use of high-frequency
ultrasound.
An object that has good material continuity and good bonding
between its layers has very little sound wave obstruction. If an object has defects such as voids, cracks, porous areas, disbonds or delaminations,
the sound wave is obstructed*. This obstruction then appears as a contrast
in the acoustic image.
Severe delamination can lead to broken wire bonds. Minor delamination
can trap contaminants. which can cause corrosion, electromigration, conductive-anodic
filaments, or other latent defects.
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