Why convert from BGA to CGA?
Area array packaging technology has taken the electronics industry
by storm. Ball Grid Array (BGA) components provide a huge increase in available
interconnects without the troubles associated with bent leads. However, these
new components bring with them serious issues related to board-level reliability
at extreme temperatures as seen in industrial, military, and space environments.
Column Grid Array (CGA) is the solution to these problems.
Figure 1. Ball Grid Array and Column Grid Array.
Figure 2. Thermal fatigue life comparison between BGA and CGA.
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