Microelectronic Component Specialist

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Acoustic Microscopy


Acoustic Microscopy is used to detect delamination in non-hermetic components. It is a method of determining hidden internal defects such as voids, delaminations, cracks or disbonds that are invisible to the naked eye. It is a non-destructive internal inspection that makes use of high-frequency ultrasound.

An object that has good material continuity and good bonding between its layers has very little sound wave obstruction. If an object has defects such as voids, cracks, porous areas, disbonds or delaminations, the sound wave is obstructed*. This obstruction then appears as a contrast in the acoustic image.

Severe delamination can lead to broken wire bonds. Minor delamination can trap contaminants. which can cause corrosion, electromigration, conductive-anodic filaments, or other latent defects.




Applicable Industry Specifications & Standards:

  • IPC/JEDEC J-STD-020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
  • IPC/JEDEC J-STD-035: Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
  • IPC/JEDEC J-STD-039: Calibration Procedure for Acoustic Microscopy
  • MIL-STD-883 Method 2030: Ultrasonic Inspection of Die Attach
  • MIL-STD-883 Method 2035: Ultrasonic Inspection of TAB Bonds