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For over 34 years, SIX SIGMA has been advancing lead finish
and soldering technology for the military, aerospace, automotive, medical, and
commercial microelectronics industry.
SIX SIGMA provides value-added services including lead finish for
component conversions and solderability failure restorations and related testing.
SIX SIGMA also provides ball attach, column attach, and failure analysis services for the
semiconductor and printed circuit board assembly industries.
Russ Winslow founded Winslow Automation, Inc., in 1986. The
original products were patented soldering fixtures (also known as solder pallets)
for through hole and surface mount semiconductor components. These pallets were
designed to adapt lead tinning of surface mount technology (SMT) IC’s to the
high volume wave soldering process. In addition to pallets, Winslow also designed
custom automation equipment for local semiconductor companies. The proliferation
of SMT technology in circuit assemblies created a need to provide lead tinning
of SMT components that could not be adapted to pallets or other methods of automated
soldering. Recognizing this need led to the development of the FlexLine®
4-Axis Robotic Solder Dip System.
In 1990, the business was expanded to include a service organization
to process microelectronics through the hot solder dip process for our customers
utilizing the FlexLine® 4-Axis Robotic Hot Solder Dip System. This
service organization is appropriately named SIX SIGMA because of our uncompromising
attention to detail and our understanding that maximizing product yields through
this step of the semiconductor assembly process is critical to our customers.
(At the time, the term SIX SIGMA was barely known even in the most progressive
quality oriented companies.) Winslow Automation, Inc. dba SIX SIGMA provides
hot solder lead finish services and related testing services, and failure analysis
services for the semiconductor and printed circuit board industries. Services
like BGA ball attach, reballing, and column attach have since been added to
fill a need in a niche market and continue to competitively position SIX SIGMA
for growth and success in the microelectronics component finishing market. In
2008 SIX SIGMA achieved AS9100B & ISO 9001:2000 certification as well as DSCC Transitional
QML Qualification.
Components processed by SIX SIGMA are found in applications
that vary from the most sophisticated missile and satellite guidance systems,
to commercial aircraft engine controllers, to automobile passive restraint systems,
to life sustaining medical electronics. The first customer parts were processed
in December of 1990 and SIX SIGMA has been a profitable and growing business
since its inception. Today SIX SIGMA is a recognized leader in semiconductor
lead finish, processing millions of high reliability semiconductor components
each year. In 1998, the Ball Grid Array Preform was recognized by Surface Mount
Technology Magazine as the 1998 Vision Rework and Repair Product of the Year.
SMT Vision Awards recognize the people and products within the surface mount
industry that serve as benchmarks for excellence. In 2001, the column attach
service was recognized by Advanced Packaging Magazine for excellence in the
interconnection category. Winning this award reflects SIX SIGMA's diligence,
innovation, and dedication to excellence.
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