Component Services
Six Sigma Microelectronics performs specialized microelectronic component modification services, such as Column Attach, Ball Attach & Reballing, and Hot Solder Dip.
Six Sigma’s column attach and hot solder dip manufacturing lines are
MIL-PRF-38535 QML-Q, V, & Y certified by the US Department of Defense.
Test Services
Test Services include: Solderability, Hermeticity, Ionic Cleanliness, Physical Dimensions, Column Pull, X-Ray Fluorescence (XRF), Ball Shear, and Lead Fatigue.
Six Sigma has been awarded Commercial Laboratory Suitability for MIL-STD-883 by the US Department of Defense.
Analytical Services
Analytical Services include: 3D X-ray, Acoustic Microscopy, and Metallographic Cross-sectioning.
Six Sigma performs analytical services in accordance with applicable government and industry standards.