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Solderability Testing

Solderability testing is used to determine the solderability of leads and terminations which are normally joined by a soldering operation. This determination is based on the ability of the terminations to be wetted by the molten solder. The test provides for accelerated aging (steam conditioning) in order to simulate the condition of the components after long-term storage.

Dip and look solderability testing is performed by subjecting the components to 0-8 hours of steam conditioning. After steam conditioning, the components' terminations are dipped into the solder in a controlled fashion using a specific activated rosin flux. After dipping, the components are inspected to the criteria specified.

Surface mount simulation testing is performed by screen printing a specific solder paste onto a ceramic plate then placing the component onto the paste, followed by a specific convection reflow profile. Surface mount simulation testing can be used on all surface mount components including BGA and CGA which cannot use the dip and look method.

All components can be tested for solderability. SIX SIGMA always considers the test to be destructive.

Applicable Specifications & Standards:

  • JEDEC JESD22-B102: Solderability
  • IPC/JEDEC J-STD-002: Solderability Tests for Components Leads, Terminations, Lugs, Terminals, and Wires
  • MIL-STD-883 Method 2003: Solderability
  • MIL-STD-750 Method 2026: Solderability
  • MIL-STD-202 Method 208: Solderability